An Ising model mapping to solve rectangle packing problem

K Terada, D Oku, S Kanamaru, S Tanaka, M Hayashi, M Yamaoka, M Yanagisawa, N Togawa
2018-04-01
DOI
タイプ
Conference paper
収録
2018 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)